新进博士教师戴厚富个人简介
发布时间: 2017-12-22 浏览次数: 1095

戴厚富 个人简历

基本信息

姓名:戴厚富  性别:男

家庭住址:湖南邵阳

学历:博士   专业:机械工程  手机号码:15885500179

电子邮箱:houfudai@163.com

  

教育背景

2017.9 – 至今贵州大学机械工程学院校聘副教授

2014.9 – 2017.6湖南大学机械工程硕博连读

2012.9 – 2014.6湖南大学力学硕士

研究方向:(1)精密加工、微纳制造

2)激光烧蚀、激光细微加工



个人技能

  1. 英语:全国英语六级考试;能熟练阅读英语文献并撰写专业领域英文论文。

  2. 工程软件:能灵活运用Lammps分子动力学开源软件以及Matlab进行数据处理,且熟知UGAbaqusAnsys等实用软件的基本操作。


    项目经验

  • 国家自科基金面上项目 “激光制造正前角金刚石磨具与正前角磨削机理研究”,编号:516751722017.1~2020.12排名第五。

  • 国家重大专项“超硬磨料砂轮数控精密修整技术与装备”编号:2012ZX04003101。主要参与人员

  • 国家自科项目“超高功率光纤激光深熔焊接超厚板缺陷产生机理和抑制方法研究”,2012~2015,参与

  • 国家科技重大专项“大尺寸三维多层曲面高功率高精度激光焊接技术与装备”子项目,2013~2015,参与


研究生期间论文撰写及发表( 本人第一作者)(陈根余、刘又文为本人导师)

1. Houfu Dai, Genyu Chen*, Cong Zhou, et al.A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation. Applied Surface Science. 2017, 393: 405-416.(二区SCI, top期刊,IF=3.387)

2. Houfu Dai, Genyu Chen*, Shaobo Li,Qihong Fang, Bang Hu, Influence of laser nano-structured diamond tools on the cutting behaviour of silicon by molecular dynamics simulation. RSC Advances. 2017, 7(25): 15596-15612. (二区SCIIF=3.108)

3. Houfu Dai, Genyu Chen*, Qihong Fang, et al. The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation. Applied Physics A. 2016, 122(9): 804. (三区SCI, IF=1.455)

4. Houfu Dai*, Genyu Chen, A molecular dynamics investigation into the mechanisms of material removal and subsurface damage of nanoscale high speed laser-assisted machining. Molecular Simulation. 2017, 43(1): 42-51. (四区SCI, IF=1.254)

5. Houfu Dai*, Shaobo Li, Genyu Chen. Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and Laser-assisted nanoscale machining via molecular dynamics simulation. Nucl Instrum Meth B. 2018, 414: 61-67. (三区SCI, IF=1.109)

6. Xinjiang Fei, Xiangzhong Jin*, Nanxiang Peng, Ying Ye, Sigen Wu, Houfu Dai. Effects of filling material and laser power on the formation of inter-metallic compounds during laser-assisted friction stir butt welding of steel and aluminum alloys. Applied Physics A. 2016, 122(11): 936. (三区SCI, IF=1.455)

7. Houfu Dai, Shaobo Li, Genyu Chen. Investigation of tool geometry in nanoscale cutting single crystal copper by molecular dynamics simulation.Journal of nanoscience and nanotechnology. (三区SCI, IF=1.338, 退修)

8. Houfu Dai, Shaobo Li, Genyu Chen. Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon. Journal of Engineering Tribology. (四区SCI, IF=1.32, 退修)

9.Houfu Dai, Shaobo Li, Genyu Chen, Guojie Liu. Influence of elliptical vibration on the nanocutting behaviour of silicon. Journal of Materials Processing Technology.(二区SCI, IF=3.147, 审稿)

10. Houfu Dai, Shaobo Li, Genyu Chen, Guojie Liu. A numerical study on subsurface quality and material removal during ultraprecision vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation. Journal of Materials Science. (二区SCI, IF=2.903, 审稿)


专利

  • 一种基于脉冲激光加工的新型正前角金刚石磨具制造方法 发明人: 陈根余; 殷赳; 周聪; 戴厚富; 王彦懿; 熊彪申请号:CN201610281488.9(已授权)(陈根余为本人导师)