戴厚富
发布人:CME  发布时间:2020-09-21   浏览次数:75


基本信息

 姓名:戴厚富    出生年月:1988.09性别:男

 民族:汉族            政治面貌:中共党员  家庭住址:湖南省邵阳市

 学历:博士后,硕士生导师     专业:机械工程     手机号码:180****9870

 电子邮箱:houfudai@163.com


教育背景

2019.1 – 至今   湖南大学博士后  机械与运载工程学院  助理研究员  合作导师:段辉高

2017.7 – 至今   贵州大学        机械工程学院   讲师

2014.9 – 2017.6湖南大学机械工程       硕博连读   导师:陈根余

2012.9 – 2014.6湖南大学力学           硕士       导师:刘又文,方棋洪


研究方向

  •  第三代半导体单晶碳化硅芯片加工制造

  •  精密制造、仿生机械表面、摩擦磨损


社会兼职

  • 担任 NanotechnologyMaterials and Design、《Jurnal of Materials ScienceJurnal of Engineering ManufactureInternational Journal of Solids and Structures、《Science China Technological Sciences》、《International Journal of Extreme Manufacturing等国际期刊审稿人


科研项目

  1. 主持在研的项目

1贵州大学潜力学科国际影响力水平提升计划项目,2020/7/23-2021/12/31, 15, 在研,主持

2贵州省科学技术基金一般项目,激光微结构化的金刚石磨粒化学机械抛光硬脆材料机理研究,黔科合基础[2020]1Y2272020/3/30-2023/3/30, 10, 在研,主持

3教育部重点实验室开放基金,金刚石磨粒化学机械抛光带缺陷单晶硅的机理研究,黔教合KY[2019]0422020/1/1-2021/12/31, 5, 在研,主持

4中国博士后科学基金2019M662765微结构化新型金刚石磨粒化学机械抛光硬脆材料机理研究,2019/12/11-2021/1/168万,在研,主持



二、主持结题的项目

1贵州省教育厅青年科技人才成长项目,黔教合KY[2018]110/纳结构化的氧化铝磨粒抛光硬脆材料机理研究,2018/11-2020/53万,结题,主持

2贵州省人才培育项目,黔科合平台人才[2017]5788-73,硬脆材料的结构化金刚石磨粒抛光机理研究, 2018/03-2020/063万,结题,主持

3贵州大学引进人才基金项目,贵大人基合字[2017]24,激光结构化金刚石刀具切削硬脆材料的超精密加工的实验和数值研究,2018/01-2020/6, 3.5万,结题,主持



三、参与的项目

  • 贵州省科学技术基金一般项目,DLC薄膜在超高速滑动摩擦中的多尺度失效机理研究,黔科合基础[2020]1Y2292020/3/30-2023/3/30, 10, 在研, 参与

  • 国家自然科学基金青年项目, 51805102, AlCrO(N)基涂层低温α-(Al,Cr,Me)2O3相形成机理及其动力学转变研究, 2019/01-2021/12,27, 在研, 参与

  • 国家自科基金面上项目,51675172,激光制造正前角金刚石磨具与正前角磨削机理研究,2017/01-2020/1262万,结题, 参与

  • 国家自然科学基金青年项目, 11402084,分叉微流管中多微胶囊流动与分离规律的三维数值研究,2015/01-2017/1226结题, 参与



发表的论文                                                             

一、以第一/通讯作者发表SCI论文17,中文核心3

1. Houfu Dai**, Yuqi Zhou, Ping Li*,Yunfei Zhang. Evolution of nano-cracks in mono-crystalline silicon in ultraprecision mechanical polishing.Journal of Manufacturing Processes. 2020, 58: 627-636. (二区SCI, IF=4.086)

2.Ping Li, Siyu Chen, Hang Xiao, Zhiquan Chen, Meina Qu, Houfu Dai*, Tan Jin**. Effects of local strain rate and temperature on the workpiece subsurface damage in grinding of optical glass.International journal of mechanical sciences. 2020, 182: 105737. (二区SCI, IF=4.631)

3.Ping Li, Tan Jin, Hang Xiao, Zhiquan Chen, Meina Qu, Houfu Dai*, Siyu Chen**. Topographical characterization and wear behavior of diamond wheel at different processing stages in grinding of N-BK7 optical glass.Tribology International. 2020, 151:106453. (一区SCItop期刊,IF=4.271)

4. Ping Li, Tan Jin, Hang Xiao, Zhiquan Chen, Meina Qu, Houfu Dai*, Siyu Chen**. Effects of wheel speed on surface/subsurface damage characteristics in grinding of glass-ceramics.Ceramics International. 2020, 46: 17717-17728. (二区SCI, 小类一区,top期刊,IF=3.83)

5. Houfu Dai*, Yuqi Zhou, Fa Zhang. Atomistic simulation of influence of laser nano-structured diamond abrasive on the polishing behavior of silicon. Materials Science in Semiconductor Processing. 2020, 105104706(三区SCI, IF=3.085)

6. Houfu Dai*, Fa Zhang, Yuqi Zhou. Numerical study of three-body diamond abrasive polishing single crystal Si under graphene lubrication by molecular dynamics simulation. Computational Materials Science. 2020, 171109214 (三区SCI, IF=2.863)

7. Houfu Dai*, Fa Zhang, Jianbin Chen. A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation.International journal of mechanical sciences. 2019, 157-158: 254-266. (二区SCI, IF=4.631)

8. HoufuDai*, Hao Du, Jianbin Chen, Genyu Chen. Influence of elliptical vibration on the behavior of silicon during nanocutting. International Journal of Advanced Manufacturing Technology. 2019, 102(9): 3597-3612. (三区SCI, IF=2.633)

9. HoufuDai*, Fa Zhang, Yuqi Zhou, Jianbin Chen. Numerical study of three-body diamond abrasive nanoindentation of single-crystal Si by molecular dynamics simulation. Applied Physics A. 2019, 125(5): 348. (四区SCI, IF=1.81)

10. HoufuDai*, Jingjing Chen, Guojie Liu. A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation. Materials Research Express. 2019,6(6):065908.(四区SCI, IF=1.929)

11. Houfu Dai*, Hao Du, Jianbin Chen, Genyu Chen. Investigation of tool geometry in nanoscale cutting single crystal copper by molecular dynamics simulation. Journal of Engineering Tribology. 2019, 233(8): 1208-1220. (四区SCI, IF=1.397)

12. HoufuDai*, Shaobo Li, Genyu Chen. Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon. Journal of Engineering Tribology. 2019, 233(1): 61-73.(四区SCI, IF=1.397)

13. HoufuDai*, Shaobo Li, Genyu Chen. Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and Laser-assisted nanoscale machining via molecular dynamics simulation. Nucl Instrum Meth B. 2018, 414: 61-67. (三区SCI, IF=1.27)

14. HoufuDai,Genyu Chen*, Shaobo Li, Qihong Fang, Bang Hu. Influence of laser nano-structured diamond tools on the cutting behaviour of silicon by molecular dynamics simulation. RSC Advances. 2017, 7(25): 15596-15612. (三区SCIIF=3.119)

15. HoufuDai, Genyu Chen*, Cong Zhou, Qihong FangXinjiang Fei. A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation. Applied Surface Science. 2017, 393: 405-416.(二区SCI, 小类一区,top期刊, IF=6.182)

16. Houfu Dai*, Genyu Chen. A molecular dynamics investigation into the mechanisms of material removal and subsurface damage of nanoscale high speed laser-assisted machining. Molecular Simulation. 2017, 43(1): 42-51. (四区SCI, IF=1.716)

17. Houfu Dai, Genyu Chen*, Qihong Fang, Jiu yin. The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation. Applied Physics A. 2016, 122(9): 804. (四区SCI, IF=1.81)

18. 胡洋,戴厚富*,周玉琪,岳海霞  纳米压痕有缺陷单晶硅的分子动力学分析,2020,中文核心(已录用

19、周玉琪,戴厚富*, 周林莉 三体抛光过程中单晶硅内纳米裂纹的演化研究,组合机床与自动化加工技术,2020(08):74-78. (中文核心)

20. 张法,戴厚富*基于分子动力学的金刚石磨粒在石墨烯润滑下三体抛光单晶硅的数值研究,组合机床与自动化加工技术,2020(04):51-56+60. (中文核心)

21戴厚富 浅谈课程改革背景下数控机械教学改革,内燃机与配件,201823239-240,省级教改论文



二、合作论文3非一作/通讯文章)

1. Jianbin Chen, Menghui Xu, Chao Xie, Jianke Du, Houfu Dai, Qihong Fang*. A nonuniform moving heat source model for temperature simulationin ultrasonic-assisted cutting of titanium alloys. International Journal of Advanced Manufacturing. 2018, 97(5-8): 3009-3021. (二区SCI, IF=2.633)

2. Xinjiang Fei, Xiangzhong Jin*, Nanxiang Peng, Ying Ye, Sigen Wu, Houfu Dai. Effects of filling material and laser power on the formation of inter-metallic compounds during laser-assisted friction stir butt welding of steel and aluminum alloys. Applied Physics A. 2016, 122(11): 936. (三区SCI, IF=1.81)

3.杜昊,田霰*厚富,周彤,陈宁,胡恒宁,赵海波AlTiCrN-DLC 涂层刀具对Inconel 718 高温合金的切削性能研究,工具技术,201953 (3): 37-41.



专利信息                                                                        

  • 新型激光结构化金刚石磨粒抛光垫及其磨粒结构化方法  发明人: 戴厚富; 周玉琪; 张法  专利号:ZL201910285226.3  已授权

  • 一种自润滑超硬涂层及其制备方法  发明人: 杜昊; 张泽; 戴厚富申请号:202010539933.3

  • 一种基于脉冲激光加工的新型正前角金刚石磨具制造方法 发明人: 陈根余; 殷赳; 周聪; 戴厚富; 王彦懿; 熊彪   专利号:ZL201610281488.9  已授权